NDLI: Semconductor Device with Double Nickel-plated Leadframe Field of the Invention

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Semconductor Device with Double Nickel-plated Leadframe Field of the Invention

Content Provider	Semantic Scholar
Author	Swayze, W. Daniel Herndon Cary W. Brady, James Telecky, Frederick J.
Copyright Year	2017
Abstract	(75) Inventor: Donald C. Abbott, Norton, MA (US) OTHER PUBLICATIONS Shinko Electric Ind. Co. Ltd., Patent Abstracts of Japan, (73) Assignee: Texas Instruments Incorporated, Patent #3228789, Registration Date Jul. 9, 2001. Dallas, TX (US) * cited by examiner (*) Notice: Subject to any disclaimer, the term of this patent is extended or adjusted under 35 U.S.C. 154(b) by 125 days. Primary Examiner Long Pham Assistant Examiner DiLinh Nguyen (74) Attorney, Agent, or Firm W. Daniel Swayze, Jr.; W. James Brady; Frederick J. Telecky, Jr. 21) Appl. No.: 10/346,899 (21) App 9 (57) ABSTRACT (22) Filed: Jan. 17, 2003 A leadframe for use in the assembly of integrated circuit (IC) (65) Prior Publication Data chips, which has first and Second Surfaces and a base metal US 2004/0140539 A1 Jul. 22, 2004 structure (606) with an adherent layer (607) of nickel having a rough, non-reflecting Surface covering the base metal. This (51) Int. Cl." . H01L23/495; H01L 23/12 rough nickel enhances adhesion to molding compounds. An (52) U.S. Cl. . 257/666; 257/762; 257/766; adherent layer (608) of smooth, reflective nickel selectively 257/767 covers the first Surface of the leadframe in areas intended for (58) Field of Search . 257/666, 762, attachment of bonding wires and the IC chip. This smooth 257/766, 767, 764, 750, 741, 781, 787, nickel facilitates the use of Vision Systems. A first adherent 677, 761, 763, 700, 676, 736, 698 metal layer (609) is deposited in selected areas of the first leadframe Surface for wire bond attachment, and a Second (56) References Cited adherent metal layer (610) is deposited to provide attach
File Format	PDF HTM / HTML
Alternate Webpage(s)	https://patentimages.storage.googleapis.com/1b/f1/d2/b8ce031270000b/US6828660.pdf
Language	English
Access Restriction	Open
Content Type	Text
Resource Type	Patent

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