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Bonded Semconductor Integrated Circuit Device Background of the Invention
| Content Provider | Semantic Scholar |
|---|---|
| Author | Hardy, David B. |
| Copyright Year | 2017 |
| Abstract | 73 Assignee: Mitsubishi Denki Kabushiki Kaisha, FOREIGN PATENT DOCUMENTS Tokyo, Japan 58-90769 5/1983 Japan. c: 61-112338 5/1986 Japan. * Notice: This patent issued on a continued proS 62-4353 1/1987 Japan. ecution application filed under 37 CFR 64-28856 1/1989 J 1.53(d), and is subject to the twenty year f apan. patent term provisions of 35 U.S.C. Primary Examiner David B. Hardy 154(a)(2). Attorney, Agent, or Firm McDermott, Will & Emery |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | https://patentimages.storage.googleapis.com/dc/6a/09/99c88e2eeaedd6/US5923091.pdf |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Patent |
