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Semconductor Device with Improved Heat Dissipation
| Content Provider | Semantic Scholar |
|---|---|
| Copyright Year | 2017 |
| Abstract | The invention relates to a semiconductor module with at least one semiconductor modular printed circuit board, which offers an improvement of the heat dissipation or a more efficient heat transport from the semiconductor chip, e.g. a memory chip or a logic chip, to the modular printed circuit board. An intermediate layer of heat-conducting material is provided between the semiconductor chip and the modular printed circuit board, the intermediate layer dissi pating the heat generated by the semiconductor chip to the modular printed circuit board. Thus, the heat generated during operation in the semiconductor chip is better dissi pated to the modular printed circuit board, which improves the cooling of the semiconductor chips and thus reduces their operating temperature. |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | https://patentimages.storage.googleapis.com/b9/b5/3b/76fcc0cffaff61/US20060113647A1.pdf |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |