Loading...
Please wait, while we are loading the content...
Similar Documents
Single-layerpolishing Pad Cross-reference to Related Applications
| Content Provider | Semantic Scholar |
|---|---|
| Copyright Year | 2017 |
| Abstract | (73) Assignee: IV TECHNOLOGIES CO., LTD., Tai(52) U.S. Cl. .............................................................. 451/527 chung (TW) (57) ABSTRACT A foamed plastic is cut to form a single-layer polishing pad 21) Appl. No.: 11A964.046 (21) Appl. No 9 having a desired rigidity and compressibility. A polishing (22) Filed: Dec. 26, 2007 Surface of the polishing pad has a higher density than a 9 mounting Surface of the polishing pad. The polishing Surface Related U.S. Application Data and the mounting Surface may have different areas having different densities for achieving desired rigidity and com (62) Division of application No. 1 1/459,352, filed on Jul. pressibility property. Furthermore, methods of making Such 22, 2006, now Pat. No. 7,335,094, which is a division |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | https://patentimages.storage.googleapis.com/de/53/f9/a2e72d8b64c94a/US20080102741A1.pdf |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |