NDLI: Shear and Pull Testing of Sn-3.0Ag-0.5Cu Solder with Ti/Ni(V)/Cu Underbump Metallization During Aging

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Shear and Pull Testing of Sn-3.0Ag-0.5Cu Solder with Ti/Ni(V)/Cu Underbump Metallization During Aging

Content Provider	Semantic Scholar
Author	Wang, Kai-Jheng Duh, Jenq-Gong
Copyright Year	2009
Abstract	Ti/Ni(V)/Cu underbump metallization (UBM) is widely used in flip-chip technology today. The advantages of Ti/Ni(V)/Cu UBM are a low reaction rate with solder and the lack of a magnetic effect during sputtering. Sn atoms diffuse into the Ni(V) layer to form a Sn-rich phase, the so-called Sn-patch, during reflow and aging. In this study, the relationship between interfacial reaction and mechanical properties of the solder joints with Ti/Ni(V)/Cu UBM was evaluated. Sn-3.0Ag-0.5Cu solder was reflowed on sputtered Ti/Ni(V)/Cu UBM, and then the reflowed samples were aged at 125°C and 200°C, respectively. (Cu,Ni)6Sn5 was formed and grew gradually at the interface of the solder joints during aging at 125°C. The Sn-patch replaced the Ni(V) layer, and (Ni,Cu)3Sn4 was thus formed between (Cu,Ni)6Sn5 and the Sn-patch at 200°C. The Sn-patch, composed of Ni and V2Sn3 after reflow, was transformed to V2Sn3 and amorphous Sn during aging. Shear and pull tests were applied to evaluate the solder joints under various heat treatments. The shear force of the solder joints remained at 421 mN, yet the pull force decreased after aging at 125°C. Both the shear and pull forces of the solder joints decreased during aging at 200°C. The effects of aging temperature on the mechanical properties of solder joint were investigated and discussed.
Starting Page	2534
Ending Page	2542
Page Count	9
File Format	PDF HTM / HTML
DOI	10.1007/s11664-009-0933-x
Volume Number	38
Alternate Webpage(s)	https://page-one.springer.com/pdf/preview/10.1007/s11664-009-0933-x
Alternate Webpage(s)	https://doi.org/10.1007/s11664-009-0933-x
Language	English
Access Restriction	Open
Content Type	Text
Resource Type	Article

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