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Low cost, high density, power packaging for space systems
| Content Provider | Semantic Scholar |
|---|---|
| Author | Lynch, Fernando |
| Copyright Year | 1998 |
| Abstract | The planned dramatic increase in satellites will require visionary design to reduce semiconductor cost, weight, and size without compromising reliability. Current designs typically use TO-254 type devices (through hole) for high power and surface mount devices (SMD) for low power. This paper will review new low cost hermetic power SMD packages used for Rectifier, Schottky, TVS, and MOSFET which can replace the TO-254 types. There are some concerns with thermal dissipation and coefficient of thermal expansion (CTE) mismatch when using high power SMD on printed circuit boards (PCB). The paper will subsequently address Hermetic Power Modules (HPM), a flight proven technology which solves both thermal and CTE mismatch problems. Typical applications and examples of common circuits using HPM technology will he reviewed. A comparative analysis will be made to existing technologies with respect to cost, size, weight, thermal and electrical performance. |
| Starting Page | 415 |
| Ending Page | 420 |
| Page Count | 6 |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | https://www.microsemi.com/sites/default/files/datasheets/Products/hpm/ESPC-98.pdf |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |
