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Electrografted insulator layer as copper diffusion barrier for TSV interposers
| Content Provider | Semantic Scholar |
|---|---|
| Author | Mévellec, Vincent Raynal, Frédéric Suhr, Dominique Dequivre, Thomas Religieux, Laurianne |
| Copyright Year | 2013 |
| Abstract | Alchimer develops alternative wet solutions based on electrografting (eG™) and chemical grafting (cG™) proprietary technologies. eG is based on surface chemistry formulations and processes. It is applied to conductive and semiconductive surfaces, and enables self-oriented growth of thin coatings of various materials, especially polymer and metals, initiated by in-situ chemical reactions between specific precursor molecules and the surface. Due to outstanding thermal, mechanical and electrical properties, electrografted polymer layers are an efficient insulation layer for TSV applications. In this paper, we fill focus on the copper diffusion barrier properties of this eG polymer layer and the associated Cost of Ownership (CoO) reduction for TSV metallization. |
| Starting Page | 1051 |
| Ending Page | 1084 |
| Page Count | 34 |
| File Format | PDF HTM / HTML |
| DOI | 10.4071/2013DPC-wa14 |
| Volume Number | 2013 |
| Alternate Webpage(s) | https://3uzly11fn22f2ax25l6snwb1-wpengine.netdna-ssl.com/wp-content/uploads/Alchimer.pdf |
| Alternate Webpage(s) | https://doi.org/10.4071/2013DPC-wa14 |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |