NDLI: Investigation of the curing behavior of a novel epoxy photo‐dielectric dry film (ViaLux™ 81) for high density interconnect applications

Content Provider	Scilit
Author	Dunne, Rajiv C. Sitaraman, Suresh K. Luo, Shijian Rao, Yang Wong, C. P. Estes, William E. Gonzalez, Ceferino G. Coburn, John C. Periyasamy, Mookan
Copyright Year	2000
Description	Journal: Journal of Applied Polymer Science
Ending Page	437
Starting Page	430
ISSN	2573508X
e-ISSN	10974628
DOI	10.1002/1097-4628%2820001010%2978%3A2%3C430%3A%3Aaid-app230%3E3.3.co%3B2-7
Journal	Journal of Applied Polymer Science
Issue Number	2
Volume Number	78
Language	English
Publisher	Wiley-Blackwell
Publisher Date	2000-10-10
Access Restriction	Open
Subject Keyword	Journal: Journal of Applied Polymer Science High Density Interconnect-printed Wiring Boards (hdi-pwb) Photo-dielectric Dry Film (pddf) Differential Scanning Calorimetry (dsc) Cure Kinetics Isoconversional Method
Content Type	Text
Resource Type	Article
Subject	Chemistry Surfaces, Coatings and Films Materials Chemistry Polymers and Plastics

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Investigation of the curing behavior of a novel epoxy photo‐dielectric dry film (ViaLux™ 81) for high density interconnect applications