NDLI: Cure processing modeling and cure cycle simulation of epoxy‐terminated poly(phenylene ether ketone). I. DSC characterization of curing reaction

Content Provider	Scilit
Author	Wang, Qiang He, Tianbai Xia, Ping Chen, Tianlu Huang, Baotong
Copyright Year	1997
Description	Journal: Journal of Applied Polymer Science
Related Links	https://onlinelibrary.wiley.com/doi/pdf/10.1002/(SICI)1097-4628(19971024)66:4<789::AID-APP19>3.0.CO;2-M
Ending Page	797
Page Count	9
Starting Page	789
ISSN	00218995
e-ISSN	10974628
DOI	10.1002/%28sici%291097-4628%2819971024%2966%3A4%3C789%3A%3Aaid-app19%3E3.3.co%3B2-e
Journal	Journal of Applied Polymer Science
Issue Number	4
Volume Number	66
Language	English
Publisher	Wiley-Blackwell
Publisher Date	1997-10-24
Access Restriction	Open
Subject Keyword	Journal: Journal of Applied Polymer Science Biotechnology and Microbiology Epoxy Resin Poly(phenylene Ether Ketone) Curing Reaction Kinetics Model and Simulation Differential Scanning Calorimetry
Content Type	Text
Resource Type	Article
Subject	Chemistry Surfaces, Coatings and Films Materials Chemistry Polymers and Plastics

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Cure processing modeling and cure cycle simulation of epoxy‐terminated poly(phenylene ether ketone). I. DSC characterization of curing reaction