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A Study of Ion Beam Etching of Polymethylmethacrylate Using $N_{2}$ and $N_{2}/O_{2}$-Mixtures
| Content Provider | Scilit |
|---|---|
| Author | Taguchi, Kozo Taguchi Kozo Ueguchi, Tomohiko Ueguchi Tomohiko Ikeda, Masahiro Ikeda Masahiro |
| Copyright Year | 2000 |
| Description | Journal: Japanese Journal of Applied Physics The influence of process parameters such as gas composition, kinetic energy of the ions and sample temperatures was studied in order to discuss the dry etching mechanism of polymers. First, we investigated polymer dry etching using $N_{2}$ gas and verified that the heating temperature was the critical parameter in the case of polymer dry etching. Next, polymer dry etching was carried out using $N_{2}–O_{2}$ gas for obtaining smooth vertical side walls. The experimental results revealed that the generation of neutralized reactive species needed to be suppressed to form smooth vertical side walls. |
| Related Links | http://iopscience.iop.org/article/10.1143/JJAP.39.5358/pdf |
| Ending Page | 5359 |
| Page Count | 2 |
| Starting Page | 5358 |
| ISSN | 00214922 |
| e-ISSN | 13474065 |
| DOI | 10.1143/jjap.39.5358 |
| Journal | Japanese Journal of Applied Physics |
| Issue Number | 9R |
| Volume Number | 39 |
| Language | English |
| Publisher | IOP Publishing |
| Publisher Date | 2000-09-01 |
| Access Restriction | Open |
| Subject Keyword | Journal: Japanese Journal of Applied Physics Polymer Dry Etching |
| Content Type | Text |
| Resource Type | Article |
| Subject | Physics and Astronomy Engineering |
