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Very high aspect ratio through-silicon vias (TSVs) fabricated using automated magnetic assembly of nickel wires
| Content Provider | Scilit |
|---|---|
| Author | Fischer, A. C. Bleiker, Simon Haraldsson, T. Roxhed, N. Stemme, Göran Niklaus, F. |
| Copyright Year | 2012 |
| Description | Journal: Journal of Micromechanics and Microengineering |
| Related Links | http://kth.diva-portal.org/smash/get/diva2:546126/FULLTEXT01 |
| ISSN | 09601317 |
| e-ISSN | 13616439 |
| DOI | 10.1088/0960-1317/22/10/105001 |
| Journal | Journal of Micromechanics and Microengineering |
| Issue Number | 10 |
| Volume Number | 22 |
| Language | English |
| Publisher | IOP Publishing |
| Publisher Date | 2012-08-17 |
| Access Restriction | Open |
| Subject Keyword | Journal: Journal of Micromechanics and Microengineering Peripheral Vascular Disease |
| Content Type | Text |
| Resource Type | Article |
| Subject | Nanoscience and Nanotechnology Mechanics of Materials Electronic, Optical and Magnetic Materials Mechanical Engineering Electrical and Electronic Engineering |