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Shearing Characteristics of Cu-Cu Joints Fabricated by Two-Step Process Using Highly <111>-Oriented Nanotwinned Cu
| Content Provider | MDPI |
|---|---|
| Author | Ong, Jia-Juen Tran, Dinh-Phuc Yang, Shih-Chi Shie, Kai-Cheng Chen, Chih |
| Copyright Year | 2021 |
| Description | Cu-Cu bonding has the potential to break through the extreme boundary of scaling down chips’ I/Os into the sub-micrometer scale. In this study, we investigated the effect of 2-step bonding on the shear strength and electrical resistance of Cu-Cu microbumps using highly -oriented nanotwinned Cu (nt-Cu). Alignment and bonding were achieved at 10 s in the first step, and a post-annealing process was further conducted to enhance its bonding strength. Results show that bonding strength was enhanced by 2–3 times after a post-annealing step. We found 50% of ductile fractures among 4548 post-annealed microbumps in one chip, while the rate was less than 20% for the as-bonded counterparts. During the post-annealing, interfacial grain growth and recrystallization occurred, and the bonding interface was eliminated. Ductile fracture in the form of zig-zag grain boundary was found at the original bonding interface, thus resulting in an increase in bonding strength of the microbumps. |
| Starting Page | 1864 |
| e-ISSN | 20754701 |
| DOI | 10.3390/met11111864 |
| Journal | Metals |
| Issue Number | 11 |
| Volume Number | 11 |
| Language | English |
| Publisher | MDPI |
| Publisher Date | 2021-11-19 |
| Access Restriction | Open |
| Subject Keyword | Metals Highly -oriented Nanotwinned Copper Die-to-die Bonding Die-to-wafer Bonding Post-annealing Grain Growth Die Shear Test |
| Content Type | Text |
| Resource Type | Article |
