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| Content Provider | IET Digital Library |
|---|---|
| Author | Hui, Li Meimei, Zheng Ran, Yao Wei, Lai Jili, Deng Haiyang, Long Haitao, Qu |
| Abstract | Modular multi-level converter (MMC) with press-packing IGBT devices is the popular and key equipment of VSC-HVDC system, its reliability is directly related to the equipment safe operation. However, it is difficult to analyse the reliability using the failure statistical approach due to less fault data. In order to improve the reliability analyses accuracy, it is necessary to use the physical failure method by considering the main components fatigue failure mode. The reliability analysis models are presented for the MMC sub-module with the press-packing IGBT device and metallised film capacitors. First, based on the MMC-HVDC simulation model, the losses and the junction temperatures of the IGBT devices were derived by the temperature field model, which the failure rates can be calculated. Furthermore, based the corrosion failure mode, the failure rate calculation of the metallised film capacitor was investigated using the voltage stress and thermal stress, the reliability calculation of the MMC sub-module was presented by combining the main components failure rates. Finally, the reliability of the VSC-HVDC based MMC was also presented with the different operation mode. The achievement is helpful to assess and improve the reliability of the VSC-HVDC. |
| Starting Page | 2219 |
| Ending Page | 2223 |
| Page Count | 5 |
| Volume Number | 2019 |
| e-ISSN | 20513305 |
| Issue Number | Issue 16, Mar (2019) |
| Alternate Webpage(s) | https://digital-library.theiet.org/content/journals/joe/conferences/cn-adc-2018 |
| Alternate Webpage(s) | https://digital-library.theiet.org/content/journals/10.1049/joe.2018.8909 |
| Journal | The Journal of Engineering |
| Publisher | The Institution of Engineering and Technology |
| Publisher Date | 2018-10-26 |
| Access Restriction | Open |
| Rights License | Creative Commons Attribution-Non Commercial-No Derivs License (http://creativecommons.org/licenses/by-nc-nd/3.0/) |
| Subject Keyword | Bipolar Transistor Capacitor Failure Corrosion Failure Mode D.C. Transmission Equipment Safe Operation Failure Analysis Failure Rate Calculation Failure Statistical Approach Fatigue Fault Data Film Capacitor HVDC Power Converter HVDC Power Transmission IGBT Device Insulated Gate Bipolar Transistors Insulated Gate Field Effect Transistors Junction Temperatures Main Component Failure Rates Main Component Fatigue Failure Mode Metallised Film Capacitor MMC Sub-module MMC-HVDC Simulation Model Modular Multilevel Converter Other Power Apparatus And Electric Machine Physical Failure Method Power Capacitor Power Transmission Reliability Press-packing IGBT Device Reliability Reliability Analysis Accuracy Reliability Analysis Model Reliability Calculation Statistical Analysis Statistics Temperature Field Model Thermal Stress Thermal Stresses Voltage Stress Voltage-source Converter VSC-HVDC System |
| Content Type | Text |
| Resource Type | Article |
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