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| Content Provider | IET Digital Library |
|---|---|
| Author | Kim, Hyun Jin Jang, Seok Pil Lee, Jong Hyun Park, Yong Jun |
| Abstract | The experimental observation of the transformation of nanosized SAC (Sn3.0Ag0.5Cu) into bulk-sized SAC during the melting process involving a large melting-point depression, using DSC (differential scanning calorimetry) and the reflow test is documented. They manufactured the nanosized SAC in dielectric benzyl alcohol using the modified direct-current arc method. The nanoparticles were spherical in shape with a size distribution of 5–10 nm. Using DSC, the endothermic peaks were continuously measured twice without changing the nanosized SAC. During the initial measurement, they observed peaks at 133, 162 and 217°C. However, in the second cycle, they observed only one peak at 217°C, which indicates the SAC nanoparticles have been completely melted and changed into bulk-sized SAC in the first cycle. They first conducted a reflow test of the SAC nanoparticles suspended in benzyl alcohol including flux on a printed circuit board and a hot plate which are 170°C. It was observed that SAC nanoparticles were transformed into bulk-sized SAC during the melting process at 170°C in less than 3 min. After the melting process, they also observed the formation of thin-layer geometry of SAC with 100 nm and intermetallic Cu6Sn5 between the SAC thin layer and a copper plate on PCB. |
| Starting Page | 840 |
| Ending Page | 843 |
| Page Count | 4 |
| Volume Number | 11 |
| e-ISSN | 17500443 |
| Issue Number | Issue 12, Dec (2016) |
| Alternate Webpage(s) | https://digital-library.theiet.org/content/journals/mnl/11/12 |
| Alternate Webpage(s) | https://digital-library.theiet.org/content/journals/10.1049/mnl.2016.0361 |
| Journal | Micro & Nano Letters |
| Publisher Date | 2016-12-01 |
| Access Restriction | Open |
| Rights Holder | © The Institution of Engineering and Technology |
| Subject Keyword | Copper Alloys Dielectric Benzyl Alcohol Differential Scanning Calorimetry Direct-current Arc Method DSC General Fabrication Technique Melting Melting Point Melting Point Depression Metals And Alloy (engineering Material Science) Nanoparticle Nanotube And Nanostructured Material Printed Circuit Board Reflow Soldering Reflow Test Silver Alloy Sn3.0Ag0.5Cu NanoParticle Sn3Ag0.5Cu Solders Solid-liquid Transitions Structure of Solid Clusters Tin Alloy |
| Content Type | Text |
| Resource Type | Article |
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