NDLI: Multistate Degradation Model for Prognostics of Solder Joints Under Vibration Conditions

Content Provider	IET Digital Library
Author	Tang, Wei Jing, Bo Huang, Yifeng Sheng, Zengjin Jiao, Xiaoxuan
Abstract	This paper develops a multistate degradation structure of the solder joints which can be used under various vibration conditions based on nonhomogeneous continuous-time hidden semi-Markov process. The parameters of the structure were estimated to illustrate the stochastic relationship between the degradation process and the monitoring indicator by using unsupervised learning methods. Random vibration tests on solder joints with different levels of power spectral density and fixed forms were conducted with a real time monitoring electrical resistance to examine the suitability of the model. It was experimentally verified that the multistate degradation structure matches the experimental process reasonably and accurately. Based on this multistate degradation model, the online prognostics of solder joint were analyzed and the results indicated that faults or failures can be detected timely, leading to appreciate maintenance actions scheduled to avoid catastrophic failures of electronics.
Starting Page	779
Ending Page	785
Page Count	7
ISSN	10224653
Volume Number	25
e-ISSN	20755597
Issue Number	Issue 4, Jul (2016)
Alternate Webpage(s)	https://digital-library.theiet.org/content/journals/cje/25/4
Alternate Webpage(s)	https://digital-library.theiet.org/content/journals/10.1049/cje.2016.07.012
Journal	Chinese Journal of Electronics
Publisher Date	2016-07-01
Access Restriction	Open
Rights Holder	© Chinese Institute of Electronics
Subject Keyword	Condition Monitoring Continuous-time Hidden Semi-Markov Process Degradation Process Dynamic Testing Electronic Catastrophic Failure Electronic Engineering Computing Electronics Packaging Failure Analysis Fault Diagnosis General Fabrication Technique Hidden Markov Model Knowledge Engineering Technique Maintenance Action Markov Processes Monitoring Indicator Multistate Degradation Model Multistate Degradation Structure Power Spectral Density Product Packaging Production Facilities And Engineering Random Vibration Test Real Time Monitoring Electrical Resistance Reliability Solder Joint Omline Prognostics Solders Unsupervised Learning Unsupervised Learning Method Vibration Condition Vibrations
Content Type	Text
Resource Type	Article
Subject	Applied Mathematics Electrical and Electronic Engineering

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