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| Content Provider | IET Digital Library |
|---|---|
| Author | Kim, J. J. Yang, K. M. Kim, J. M. Kim, Y. J. Lee, S. Y. |
| Abstract | Accurate modelling of a chip is a very important factor when analysing and predicting radio-frequency (RF) receiver sensitivity. Chip modelling based on the tangential electromagnetic (EM) field from the near-field measurement just above the top surface of the chip is introduced, and a methodology utilising three-dimensional (3D) EM simulation, for predicting receiver sensitivity generated by the chip-noise of a mobile phone, is suggested. It is worth noting here that the calculation of absolute coupling values between a noise source and an antenna is possible by using the real measured data source to obtain reliable results. |
| Starting Page | 1753 |
| Ending Page | 1755 |
| Page Count | 3 |
| ISSN | 00135194 |
| Volume Number | 50 |
| e-ISSN | 1350911X |
| Issue Number | Issue 23, Nov (2014) |
| Alternate Webpage(s) | https://digital-library.theiet.org/content/journals/el/50/23 |
| Alternate Webpage(s) | https://digital-library.theiet.org/content/journals/10.1049/el.2014.1355 |
| Journal | Electronics Letters |
| Publisher Date | 2014-10-30 |
| Access Restriction | Open |
| Rights Holder | © The Institution of Engineering and Technology |
| Subject Keyword | 3D EM Simulation Antenna Chip Modelling Chip Noise Circuit Simulation Digital Circuit Design, Modelling And Testing Electromagnetic Field Integrated Circuit Modelling Integrated Circuit Noise Microwave IC Mobile Phone Mobile Radio System Near Field Measurement Noise Source Radio Receiver Radiofrequency Integrated Circuit RF Receiver Sensitivity Analysis Sensitivity Analysis Single Antenna Smart Phones Tangential Electromagnetic Field |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electrical and Electronic Engineering |
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