NDLI: Thermo-mechanical analysis of 3-D multilayer structures for power electronic devices

Content Provider	IEEE Xplore Digital Library
Author	Bagnoli, P.E. Girardi, M. Padovani, C. Pagni, A. Pasquinelli, G.
Copyright Year	2010
Description	Author affiliation: Institute of Information Science and Technologies “A. Faedo”, Italian National Research Council CNR, Pisa, Italy (Girardi, M.; Padovani, C.; Pagni, A.; Pasquinelli, G.) \|\| Department of Information Engineering, University of Pisa, Italy (Bagnoli, P.E.)
Abstract	An integrated simulation tool for multilayer stepped pyramidal structures, able to calculate the temperature distributions and thermal stresses at the interfaces between the layers and based on a semi-analytical mathematical strategy is presented. The core of the thermal solver is the analytical simulator DJOSER for power electronic devices. DJOSER is then integrated with a mechanical solver based on the finite element method. A new element is proposed whose geometry is defined by its mean surface and thickness, just like in a plate, and whose mechanical behaviour is fully three-dimensional, in the sense that the deformability in the direction orthogonal to the mean surface is taken into account. The dedicated finite element code developed for solving the equilibrium problem of structures made up of two or more superimposed plates subjected to thermal loads is applied to some two-layer samples made of silicon and copper. The comparisons with the results of standard finite element analyses using a large number of brick elements are presented and discussed.
Starting Page	69
Ending Page	75
File Size	845816
Page Count	7
File Format	PDF
ISBN	9781612842684
e-ISBN	9781612842677
DOI	10.1109/THETA.2010.5766381
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-12-19
Publisher Place	Egypt
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermomechanical processes Nonhomogeneous media Silicon Finite element methods Mathematical model Copper Stress
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in