NDLI: Temperature monitoring in laser assisted polymer bonding for MEMS packaging using a thin film sensor array

Content Provider	IEEE Xplore Digital Library
Author	Yufei Liu Jun Zeng Changhai Wang
Copyright Year	2009
Description	Author affiliation: School of Engineering and Physical Sciences, Heriot Watt University, Edinburgh, EH14 4AS, UK (Yufei Liu; Jun Zeng; Changhai Wang)
Abstract	Laser assisted polymer bonding is a novel technique for MEMS packaging, which can offer a short bonding time and reduce the thermally induced stress during the packaging process. However, due to the localised nature of the temperature rise, it is difficult to monitor the temperature change precisely during the bonding process using the conventional methods. In this paper, the development of thin film miniature temperature sensor arrays is presented for in-situ temperature monitoring in the laser assisted polymer bonding process. A high-power fibre-coupled diode laser at the wavelength of 970nm was used as the heat source for benzocyclobutene (BCB) bonding/curing in conjunction with novel beam forming optics that allows selective illumination of the substrates to be joined. Instead of using infrared detectors and temperature-sensitive paints in our previous work, thin film microsensor arrays were designed and fabricated on both glass and silicon substrates for obtaining the precise in-situ temperature change and the thermal distribution during the laser bonding process. The minimum track width of a meander sensor in the array was 3µm resulting in a foot print of only 250µm×240µm for the smallest sensor. The key parameters of the laser bonding process, such as laser beam profile, power and the resultant thermal responses, were investigated as well as the effect of the thermal arrangement underneath the substrate assembly.
Starting Page	52
Ending Page	55
File Size	1168254
Page Count	4
File Format	PDF
ISBN	9781424427864
DOI	10.1109/SAS.2009.4801776
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-02-17
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Bonding processes Polymer films Thin film sensors Substrates Sensor arrays Optical arrays Temperature sensors Temperature measurement Micromechanical devices MEMS packaging sensor array Packaging laser assisted bonding in-situ temperature monitoring
Content Type	Text
Resource Type	Article

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