NDLI: Electrical performance analysis of fine line on high density package substrate

Content Provider	IEEE Xplore Digital Library
Author	Hung-Chun Kuo Ming-Fong Jhong Hung-Hsiang Cheng Chen-Chao Wang Chih-Pin Hung
Copyright Year	2015
Description	Author affiliation: Electr. Lab., Product Design Div., Adv. Semicond. Eng., Inc., Kaohsiung, Taiwan (Hung-Chun Kuo; Ming-Fong Jhong; Hung-Hsiang Cheng; Chen-Chao Wang; Chih-Pin Hung)
Abstract	This paper presents the electrical characterization of fine line design. For this kind of very thin and narrow fine lines in high density substrate, the trace is no longer lossless or low-loss transmission line and the characteristic impedance is also varying with frequency. This phenomenon on high density substrate will lead to different design guideline from conventional one. In this paper, the electrical performance of the micro-strip line (MSL) with coupling trace, Co-Planar Waveguide (CPW) and Grounded Co-Planar Waveguide (GCPW) three transmission line designs will be analyzed and discussed. For fine pitch fabrication quality control, it is better to keep thick-width-aspect-ratio larger than 1.5. As a result the trace is designed to 3um thick and 2um wide. Impedance, conductor loss, cross-talk and eye diagram for 10mm long trace will be analyzed in this paper. Proper design of line pitch of GCPW to have good signal integrity performance is then demonstrated.
Starting Page	179
Ending Page	182
File Size	930897
Page Count	4
File Format	PDF
ISBN	9781479988143
e-ISBN	9781479988150
DOI	10.1109/ICSJ.2015.7357391
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-11-09
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Couplings Power transmission lines signal integrity fine line 2.1D Coplanar waveguides Impedance Copper Time-domain analysis Substrates high density substrate
Content Type	Text
Resource Type	Article

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