NDLI: Analysis of novel technology for power and signal integrity using a metal particle conductive layer

Content Provider	IEEE Xplore Digital Library
Author	Sasaoka, N. Oono, M. Ueda, C. Otsuka, K.
Copyright Year	2014
Description	Author affiliation: Meisei Univ., Hino, Japan (Ueda, C.; Otsuka, K.) \|\| Nippon Kodoshi Corp., Kochi, Japan (Sasaoka, N.; Oono, M.)
Abstract	Power integrity (PI) has been an important technological issue in the field of electronic circuits and systems. It has been addressed in important papers using several different approaches [1][2]. The latest concept of the best PI condition is a low impedance between the power and ground lines or planes, that can be maintained regardless of the clock frequency, even in the GHz region. A novel technology was used in our previous study, in which a metal particle conductive layer (MPCL) was used instead of a copper plane [3][4]. This structure improved the PI for any clock frequency, particularly in the GHz region. The MPCLs consist of micrometer sized silver flakes (SF) and binder resin. In this study, we used an epoxy as a binder for conductive paste, polyimide (PI) copper clad laminate (CCL) and 60 μm thickness prepreg as the inner dielectric of test coupons. These are general-use material so that they can be made easily, and apply to printed circuit boards (PCBs) and package substrates (PKGs). It has been found from transmission line test coupon measurements, that energy propagation time and frequency characteristics, are strongly affected by the metal particle content and chemical composition. From power/GND plane test coupon measurements, MPCL can reduce Z11 about 70% compared with copper plane from 1 to 5GHz frequency region. In this paper, we will show the detailed phenomena of MPCL, exceeding the region of usual transmission line theory, and MPCL adaptability to commercial materials of PCB and PKG.
Starting Page	114
Ending Page	117
File Size	1077202
Page Count	4
File Format	PDF
ISBN	9781479961948
e-ISBN	9781479961955
DOI	10.1109/ICSJ.2014.7009623
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-11-04
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Power transmission lines signal integrity Metals Polyimides Curing Conductivity Transmission line measurements impedance Dielectrics power integrity
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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