NDLI: Simulation of differential skew considering fiber kink effects

Content Provider	IEEE Xplore Digital Library
Author	Fukumori, T. Nagaoka, H. Mizutani, D. Tani, M.
Copyright Year	2014
Description	Author affiliation: Fujitsu Labs. Ltd., Atsugi, Japan (Fukumori, T.; Nagaoka, H.; Mizutani, D.; Tani, M.)
Abstract	As a result of increasing signal transmission rates to as high band levels as several tens of Gbps, skew induced by the difference in dielectric constant between the glass-cloth and the resin is posing a huge problem. However, due to the extremely difficult comparison of this skew between actual measurements and simulations, few studies on such comparison have been reported to date. We developed a new analysis technique to clarify the transmission delay time difference (skew) in differential signal transmission lines, depending on the positional relationship between the glass-threads and the conductor lines in a circuit board. This analysis technique has the following four characteristics. The first is that the angle of the lines to the glass-cloth is expressed by cascade connections of multiple analytical models that are different in the positional relationship between the glass-cloth and the lines. The second is that analytical models are combined in cascade connection assuming that the positional relationship between the lines and the glass-cloth appears randomly and is distributed uniformly. The third is that analytical models are prepared assuming that the angle between the lines and the glass-cloth is distributed uniformly within a certain range due to fiber kink effects. The fourth is that the assumption that skew in stripline structure, which has two glass-cloth insulating layers right above and below the lines, can be calculated by the sum of two sets of the skew induced by one glass-cloth-containing insulating layer. As a result of comparison between analysis and actual measurement results, it was confirmed that this analysis technique could reproduce skew distributions observed in real circuit boards with a high degree of accuracy.As a result of comparison between analysis and actual measurement results, it was confirmed that this analysis technique could reproduce skew distributions observed in real circuit boards with a high degree of accuracy.
Starting Page	43
Ending Page	46
File Size	866405
Page Count	4
File Format	PDF
ISBN	9781479961948
e-ISBN	9781479961955
DOI	10.1109/ICSJ.2014.7009605
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-11-04
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Stripline Printed circuits simulation kink Probability distribution Yarn Analytical models probability distribution function glass-cloth Weaving yarn Integrated circuit modeling weave skew Gbps
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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