NDLI: Novel compact bandpass filters for high-density packaging applications

Please wait, while we are loading the content...

2015 IEEE CPMT Symposium Japan (ICSJ)

IEEE CPMT Symposium Japan 2014

2013 3rd IEEE CPMT Symposium Japan

2012 2nd IEEE CPMT Symposium Japan

IEEE CPMT symposium Japan 2012 committee members

Plenary speakers

Program session

High-stability 25 Gb/s optical transceiver module with flexible polymer wave guide for optical interconnection

A 25-Gbit/s high-speed optical-electrical printed circuit board for chip-to-chip optical interconnections

Integrated package for 100G ethernet optical transmitter

Graded-index core polymer optical waveguide for high-speed and high-density on-board interconnects

Improvement of polynorbornene waveguide based O/E module performance with microlens structure

Light-induced self-written waveguide for optoelectronic integration devices

Analysis of inter-channel crosstalk in multi-mode parallel optical waveguide using Beam Propagation Method

Low-temperature bonding of laser diode chips using atmospheric-pressure plasma activation of flat topped Au stud bumps with smooth surfaces

Low temperature Cu-Cu direct bonding for 3D-IC by using fine crystal layer

Room temperature microjoining of qVGA class area-bump array using cone bump

Cu wire bonding knows no limit - 28 nm is qualified

Impact test performance of Zn-based die-attach joints for power devices

Productivity improvement of copper pillar flip-chip package by pre-applied materials and press machine

Joint reliability study of solder capped metal pillar bump interconnections on an organic substrate

Effect of preformed Cu-Sn IMC layer on electromigration reliability of solder capped Cu pillar bump interconnection on an organic substrate

Fast life-time assessment of LED luminaries

Solid-state bonding using metallic cone layer for interconnection

Ni barrier for tin whisker mitigation

Heterogeneous integration of MEMS sensor array and CMOS readout IC with Through Silicon Via interconnects

Electrochemical analysis of cathode in TSV copper electroplating

Thin packaging - What is next?

Large scale System-in-Package (SiP) module for future networking products

Novel DAF (Die Attach Film) separation technologies for ultra-thin chip

Volume production technologies for passive and active components embedded PWB

Electrical properties of flexible Vertically aligned Carbon Nanotube bumps under compression

Athermal and tunable VCSELs with a thermally actuated cantilever structure for WDM optical interconnects

Modeling and experiment on low voltage slow-light electro-absorption modulators for high-speed and low power consumption optical interconnect

Cavity-resonator-integrated guided-mode resonance filter with reflection phase variation

Compact multi-fiber receptacle interface for on-board optical interconnection

Sn-Ag-Cu-solder-reflow-capable 10-Gb/s × 4-channel very thin high-density parallel-optical modules

Development of low-cost elastic optical multifiber connector for optical interconnection

A compound of RGB-splitter and condensers for compact image sensor

Ultracompact 4×3.4 Gbps optoelectronic package for an active optical HDMI cable

High bright white LED packaging systems using unique vacuum printing technology (VPES)

Effects of GaN blue LED chip and phosphor on optical performance of white light LED

Color Tuning dispense process to minimize color variation

Temporary bonding/de-bonding and permanent wafer bonding solutions for 3D integration

Low cost TSV integration for advanced packaging technologies

Wide bus chip-to-chip interconnection technology using fine pitch bump joint array for 3D LSI chip stacking

Board level drop test modeling

Investigation of fracture behaviors of Cu-Sn intermetallics using impact test

Prognostic health monitoring method for printed circuit boards subjected to random cyclic loads

A built-in electrical test circuit for interconnect tests in assembled PCBs

Warpage modeling for 3D packages

In-situ observation of whisker nucleation in air with AFM

Low cycle fatigue crack initiation and propagation behavior of copper thin films used in electronic devices

Nondestructive defect analysis solution using combination of Lock-in IR thermography and high resolution X-ray CT technology

Development of DAF (Die Attach Film) with functional gettering agent for metal impurities

Examination of insoluble anodes used for acid copper plating

Effects of additional Ni and Co on microstructural evolution in Sn-Ag-Bi-In solder under current stressing

Surface characterization of resilience sheet as a packaging material for the metallic ink printing

Thermal and electric conductive analysis in Isotropic Conductive Adhesive by modeling 3D fillers dispersion observed by FIB-SEM

Phase transformation of Cu@Ag core-shell nanoparticles upon heating

Novel EMI shielding methodology on highly integration SiP module

Proposal and analysis of three-phase filter by using mixed-mode S-parameter based on Fortescue transformation

VLSI nano-scale interconnect induced crosstalk power estimation

Statistical study of nano-scale VLSI interconnect crosstalk and its induced power estimation

60GHz antenna integrated transmitter module

3D integration techniques using stacked PCBs and small dipole antenna for wireless sensor nodes

Wireless body area communication using electromagnetic resonance coupling

Development of human body communication transceiver based on impulse radio scheme

Measurement results of substrate bias dependency on Negative Bias Temperature Instability degradation in a 65 nm process

Co-simulation of AC power noise of CMOS microprocessor using capacitor charging modeling

Power supply noise suppression by optimizing on-die PDN impedance

Macromodeling of complex power delivery networks for efficient transient simulation

Novel technology for power integrity using a metal particle conductive layer

A signal and power integrity oriented packaging for low cost and high performance systems

Electromagnetic Band Gap structure for cut off of low frequency noise in 3-D printed circuit board

Development of a novel thermal compression flip chip bonding with pre-applied NCF underfill

Using nano-porous Au-Ag sheets as a joint layer for low-temperature Au-Au bonding

Development of low temperature curable positive tone photosensitive dielectric material

Low temperature bonding using sub-micron Au particles for wafer-level MEMS packaging

Chip-based hetero-integration technology for high-performance 3D stacked image sensor

Heterogeneous 3D Stacking technology developments in ASET

Thermal stress and die-warpage analyses of 3D die stacks on organic substrates

Study for CMOS device characteristics affected by ultra thin wafer thinning

Three-dimensional integration scheme using hybrid wafer bonding and via-last TSV process

Introduction of the automotive application of TSV device

3D system simulation study of power integrity using Si interposer with distribution TSV decoupling capacitors

Transient response characteristics of through silicon via in high resistivity silicon interposer

PDN characteristics of 3D-SiP with a wide-bus structure under 4k-IO operations

A highly reliable single-crystal silicon RF-MEMS switch using Au sub-micron particles for wafer level LTCC cap packaging

Characterization of signal via structure in multilayer printed circuit boards up to 50 GHz

Study of the insertion loss of a differential pair of through holes for the 25-Gbps serial interconnect

Novel compact bandpass filters for high-density packaging applications

Development of low CHE, negative-tone, photo-definable polyimide for HDD suspension

Build-up electrical insulation material for high speed & high-frequency

Formation of circuit patterns on the only modification area using selective electroless deposition

Influence of the power-consumption at non-fundamental frequency on Passive intermodulation generation

Influence of a foam supporter on passive intermodulation measurement using standing-wave coaxial tube method

Fundamental study of direct current resistance effect on transmission line characteristics

Investigation on the mutual inductance of on-chip transformers

Phase change cooling for energy-efficient ICT systems

Impact of energy relaxation time on heat generation in silicon with electro-thermal analysis

Investigation of thermal management method for coil and capacitor in automobile ECU

Experimental study on thermal performance of loop heat pipes with flat evaporator for LSI package

2010 IEEE CPMT Symposium Japan

2008 IEEE 9th VLSI Packaging Workshop of Japan

Central Library (ISO-9001:2015 Certified)
Indian Institute of Technology Kharagpur
Kharagpur, West Bengal, India | PIN - 721302

See location in the Map
03222 282435
Mail: support@ndl.gov.in

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in