NDLI: A thin film thermoelectric cooler for chip-on-board direct assembly

Content Provider	IEEE Xplore Digital Library
Author	Hyunju Lee Soonseo Park Sungkyu Cho Hyojong Kim Shiho Kim
Copyright Year	2009
Description	Author affiliation: Dept. of Electrical Engineering, Chungbuk National University, 410 Sungbong-Ro, Cheongju, 305-761, Korea (Hyunju Lee; Soonseo Park; Sungkyu Cho; Hyojong Kim; Shiho Kim)
Abstract	A thin film solid state cooler for COB direct assembly using supperlattice based thermoelectric material is reported. The embedded cooler attached between the die chip and metal plate can provide site-specific cooling as well as active on-demand cooling. This demonstration offers the possibility of thin film active cooling for the COB direct assembly. The high power density of chip-on-Board would be no longer be limited by cooling capability. This technology can be extended to the case of hot spot cooling for COB assembly that can be selectively switched on and off depending on which part of the chip is in critical need of cooling at any point of time.
Starting Page	1
Ending Page	4
File Size	985516
Page Count	4
File Format	PDF
ISBN	9781424453504
DOI	10.1109/EDAPS.2009.5403990
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-12-02
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Cooling Heat pumps Semiconductor thin films Thermal management Thin film transistors Wire Bonding Thermoelectricity Assembly Semiconductor device packaging
Content Type	Text
Resource Type	Article

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