NDLI: RF-Powered Silicon-MEMS Microsensors for Distributed and Embedded Sensing Applications

Content Provider	IEEE Xplore Digital Library
Author	Takao, H. Kizuna, S. Sawada, K. Sudou, M. Ishida, M.
Copyright Year	2007
Description	Author affiliation: Toyohashi Univ. of Technol., Toyohashi (Takao, H.; Kizuna, S.; Sawada, K.)
Abstract	In this paper, the concept and experimental results of microwave-powered silicon microsensors for distributed and embedded sensing applications are presented. This is the first report of a microsensor device integrated with RF-DC power converter on the same chip. The integrated sensors are fabricated by silicon-MEMS (Micro Electromechanical Systems) technology. This time, 'fuse-type strain detector', and 'water-leakage sensing switch' are fabricated by silicon micromachining. Driving power of the integrated microsensors is provided as a remote RF-electromagnetic wave at 1.29 GHz/1.45 GHz, and received at the rectenna circuit on the microsensor. In the fabrication experiments, high-performance surface mount devices (SMD) are integrated on the silicon microchip to realize the highest power efficiency. Mount holes of SMDs were formed by Deep-RIE of silicon with MEMS sensor structures without any additional process steps. Fabricated rectenna and sensors are successfully evaluated with LED mounted for signal output. The battery-less microsensor chip was successfully driven by a 10 W/1.29 GHz microwave power. Using a directional antenna as the power emission source, spread of microwave power is limited, and a longer distance of microwave power transmission is obtainable. The RF-powered microsensor node is very promising for various applications, and its conceptual prototype has been successfully fabricated.
Sponsorship	Transducer Res. Found.
Starting Page	35
Ending Page	42
File Size	3099152
Page Count	8
File Format	PDF
ISBN	1424412315
DOI	10.1109/INSS.2007.4297384
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-06-06
Publisher Place	Germany
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Integrated circuit technology Wireless sensor Switches Sensor systems Capacitive sensors Micro electro mechanical devices Electromechanical systems Smart sensors component Rectennas Microwave-powed devices Microwave devices Rectenna Sensor networks Silicon Microsensors Electromechanical sensors
Content Type	Text
Resource Type	Article

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