NDLI: Traffic- and Thermal-Aware Run-Time Thermal Management Scheme for 3D NoC Systems

Content Provider	IEEE Xplore Digital Library
Author	Chih-Hao Chao Kai-Yuan Jheng Hao-Yu Wang Jia-Cheng Wu An-Yeu Wu
Copyright Year	2010
Abstract	Three-dimensional network-on-chip (3D NoC), the combination of NoC and die-stacking 3D IC technology, is motivated to achieve lower latency, lower power consumption, and higher network bandwidth. However, the length of heat conduction path and power density per unit area increase as more dies stack vertically. Routers of NoC have comparable thermal impact as processors and contributes significant to overall chip temperature. High temperature increases the vulnerability of the system in performance, power, reliability, and cost. To ensure both thermal safety and less performance impact from temperature regulation, we propose a traffic- and thermal-aware run-time thermal management (RTM) scheme. The scheme is composed of a proactive downward routing and a reactive vertical throttling. Based on a validated traffic-thermal mutual-coupling co-simulator, our experiments show the proposed scheme is effective. The proposed RTM can be combined with thermal-aware mapping techniques to have potential for higher run-time thermal safety.
Starting Page	223
Ending Page	230
File Size	1554924
Page Count	8
File Format	PDF
ISBN	9781424470853
e-ISBN	9781424470860
DOI	10.1109/NOCS.2010.32
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-05-03
Publisher Place	France
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Temperature run-time thermal management Power system management 3D NoC Telecommunication traffic 3D IC traffic-aware Delay thermal-aware routing Runtime throttling Network-on-a-chip Thermal management Power system reliability Safety Three-dimensional integrated circuits
Content Type	Text
Resource Type	Article

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