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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Kun-Chih Chen Shu-Yen Lin Hui-Shun Hung An-Yeu Wu |
| Copyright Year | 2012 |
| Description | Author affiliation: Grad. Inst. of Electron. Eng., Nat. Taiwan Univ., Taipei, Taiwan (Kun-Chih Chen; Shu-Yen Lin; Hui-Shun Hung; An-Yeu Wu) |
| Abstract | The thermal issue is important for 3D Network-on-Chip systems. To ensure the thermal safety, the near-overheat routers are throttled and the 3D topology becomes Non-Stationary Irregular Mesh (NSI-Mesh). To ensure the successful packet delivery in the NSI-Mesh, Transport Layer Assisted Routing (TLAR) scheme was proposed. It has better performance than the conventional routing approaches for NSI-Mesh. However, it still suffers significant traffic congestion in the bottom chip layer due to the insufficient lateral path diversities. To achieve more balanced traffic, we propose a Traffic-balanced Topology-aware Multiple Routing Adjustment (TTMRA). The experimental results show that the proposed TTMRA can improve 81.8% ~102.3% network throughput than TLAR scheme. |
| Sponsorship | IEEE Signal Process. Soc. |
| Starting Page | 120 |
| Ending Page | 124 |
| File Size | 1028784 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781467329866 |
| ISSN | 21623562 |
| e-ISBN | 9781467329873 |
| DOI | 10.1109/SiPS.2012.13 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2012-10-17 |
| Publisher Place | Canada |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Routing Topology System-on-a-chip Telecommunication traffic Thermal management Throughput Tiles 3D IC Topology-aware Adaptive Routing Transport Layer Assisted Routing 3D NoC |
| Content Type | Text |
| Resource Type | Article |
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