NDLI: Behavior of switching noise and electromagnetic radiation in relation to package properties and on-chip decoupling capacitance

Content Provider	IEEE Xplore Digital Library
Author	Sudo, T.
Copyright Year	2006
Description	Author affiliation: Corp. Manuf. Eng. Center, Toshiba Corp., Yokohama (Sudo, T.)
Abstract	Simultaneous switching noise (SSN) and electromagnetic radiation were intensively examined experimentally by using different test LSIs and packages. Two types of test LSIs have been designed and fabricated in 0.25 um CMOS process. One was with on-chip decoupling capacitance (ODC), and the other was without ODC. Then, two types of packages; quad flat package (QFP) and chip scale package (CSP) were used for housing them. First, SSN and radiated emission for the combination of two types of chips and two types of packages were measured by exciting output circuit and core logic circuit independently. QFP with larger package inductance showed larger power/ground fluctuation than CSP. On the other hand, QFP showed smaller emission properties than CSP. It is because package inductance worked as a filtering component. For both packages, every harmonics was reduced for the core circuit operation due to ODC, while it has been found that only even-order harmonics were dramatically decreased for the output buffer circuit operation
Starting Page	568
Ending Page	573
File Size	1174967
Page Count	6
File Format	PDF
ISBN	3952299030
DOI	10.1109/EMCZUR.2006.214998
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-02-27
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	ETH Zurich, Swiss Federal Institute
Subject Keyword	Inductance Electromagnetic interference Circuits Electromagnetic radiation Capacitance CMOS process Chip scale packaging Power harmonic filters Electronics packaging Testing
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Study on power supply noise and electromagnetic radiation in relation to chip-package anti-resonance

Electromagnetic radiation and simultaneous switching noise in a CMOS device packaging

Characterization of on-chip capacitance effects for I/O circuits and core circuits

Reduction in radiated emission using CSP with built-in decoupling components

Design, Modeling, and Characterization of Embedded Capacitor Networks for Core Decoupling in the Package

Decoupling capacitor calculations for CMOS circuits

Electromagnetic modeling of simultaneous switching noise in power and ground planes in electronic packages

Active inductor for power-supply decoupling in mixed signal systems

Simultaneous switching noise projection for high-performance SOI chip design

Behavior of switching noise and electromagnetic radiation in relation to package properties and on-chip decoupling capacitance

Similar Documents

Study on power supply noise and electromagnetic radiation in relation to chip-package anti-resonance

Electromagnetic radiation and simultaneous switching noise in a CMOS device packaging

Characterization of on-chip capacitance effects for I/O circuits and core circuits

Reduction in radiated emission using CSP with built-in decoupling components

Design, Modeling, and Characterization of Embedded Capacitor Networks for Core Decoupling in the Package

Decoupling capacitor calculations for CMOS circuits

Electromagnetic modeling of simultaneous switching noise in power and ground planes in electronic packages

Active inductor for power-supply decoupling in mixed signal systems

Simultaneous switching noise projection for high-performance SOI chip design

Behavior of switching noise and electromagnetic radiation in relation to package properties and on-chip decoupling capacitance