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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Muthana, P. Engin, A.E. Swaminathan, M. Tummala, R. Sundaram, V. Wiedenman, B. Amey, D. Dietz, K.H. Banerji, S. |
| Copyright Year | 1999 |
| Abstract | Embedded passives are gaining in importance due to the reduction in size of electronic products. Capacitors pose the biggest challenge for integration in packages due to the large capacitance required for decoupling high performance circuits. Surface mount discrete (SMD) capacitors become ineffective charge providers above 100 MHz due to the increased effect of loop inductance. This paper focuses on the importance of embedded capacitors above this frequency. Modeling, measurements, and model to hardware correlation of these capacitors are shown. Design and modeling of embedded capacitor arrays for decoupling processors in the midfrequency band (100 MHz-2 GHz) is also highlighted in this paper. |
| Sponsorship | IEEE Components, Packaging, and Manufacturing Technology Society IEEE Components, Packaging and Manufacturing Technology Society |
| Starting Page | 809 |
| Ending Page | 822 |
| Page Count | 14 |
| File Size | 2604183 |
| File Format | |
| ISSN | 15213323 |
| Volume Number | 30 |
| Issue Number | 4 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2007-11-01 |
| Publisher Place | U.S.A. |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Frequency Electronics packaging Voltage Capacitance Impedance Switching circuits Inductance Switched capacitor circuits Semiconductor device noise Clocks thick film Decoupling capacitors embedded capacitors measurement midband frequency modeling package power delivery simulation simultaneous switching noise |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electrical and Electronic Engineering |
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