NDLI: Challenges and opportunities for transient thermal imaging of microelectronic devices

Content Provider	IEEE Xplore Digital Library
Author	Yazawa, K. Kendig, D. Hernandez, D. Maze, K. Shakouri, A.
Copyright Year	2012
Description	Author affiliation: Microsanj, LLC. (Santa Clara, California, USA) (Yazawa, K.; Kendig, D.) \|\| University of California Santa Cruz (Santa Cruz, California, USA) (Hernandez, D.; Maze, K.; Shakouri, A.)
Abstract	In the development of electronic devices, transient thermal information is necessary to validate whether the entire device or a specific part of the device is operating properly. This becomes even more important for higher frequency operation of such devices. Sometimes, this is more important for the circuit designers, process engineers, or chip architects, rather than the thermal or package engineers who mostly need just a few points or locations of time-averaged temperature data during the design phase. For the time domain, recent developments in thermoreflectance imaging allow us to achieve a wide range of time scales from 50 nanoseconds up to milliseconds. This study provides an example of transient thermal imaging on a test chip along with the thermoreflectance imaging technique. The discussion covers the relationship of spatial resolution and time resolution considering the ‘time constant’ component of the chip. Spatial resolution for thermoreflectance is limited by the diffraction of the illuminating light, time resolution is limited by the high speed electrical signal management, and temperature resolution is limited by the signal-to-noise ratio. Time averaging, therefore, plays an important role in determining temperature resolution. The scientific inter-relationship between these factors adds to the complexity. The modeling work described above provides a guideline for the ‘scope’ and ‘probe’ depending on the dimensional scale of interest.
Starting Page	1
Ending Page	4
File Size	984094
Page Count	4
File Format	PDF
ISBN	9781467318822
e-ISBN	9782355000232
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-09-25
Publisher Place	Hungary
Access Restriction	Subscribed
Rights Holder	CMP
Subject Keyword	Thermoreflectance imaging Electronic packaging thermal management Spatial resolution Transient analysis Signal resolution
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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