NDLI: MIMO stochastic minimum variance control strategies for improving plasma characteristics in Reactive Ion Etching

Content Provider	IEEE Xplore Digital Library
Author	Tudoroiu, N. Khorasani, K. Patel, R.V. Chiru, C. Tudoroiu, R.-E.
Copyright Year	2009
Description	Author affiliation: University of Western Ontario, London, Ontario, Canada (Patel, R.V.) \|\| West University ¿Politehnica Timisoara¿, Timisoara, Romania (Tudoroiu, R.-E.) \|\| Spiru Haret University, Constantza, Romania (Chiru, C.) \|\| Concordia University, Montreal, Canada (Khorasani, K.) \|\| Concordia University, Montreal, Canada, Spiru Haret University, Constantza, Romania (Tudoroiu, N.)
Abstract	In this paper, we propose to use multi input multi-output (MIMO) stochastic minimum variance control strategy to control the plasma characteristics in Reactive Ion Etching (RIE) process. Given the RIE model in the state-space representation a stochastic adaptive minimum variance tracking controller (SMVAC) is designed and tuned to control the key plasma parameters. For the stochastic adaptive minimum variance approach a system identification scheme based on the minimum variance principle is integrated with a control strategy derived from minimization of a per-interval performance index. This control strategy performs very well, has good accuracy, as demonstrated in simulation environment, and can easily be applied to MIMO RIE system. The principal idea is that by controlling appropriate key plasma parameters (the concentrations of the reactive radicals and ions and ions energy) it is possible to improve the etch performance of the reactive ion etchers, namely their selectivity, uniformity, anisotropy and etch depth. The proposed real-time control strategies reveal superior accuracy and performance when compared to the results available in the plasma literature.
Starting Page	311
Ending Page	316
File Size	349885
Page Count	6
File Format	PDF
ISBN	9781424450572
DOI	10.1109/WISP.2009.5286547
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-08-26
Publisher Place	Hungary
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Plasma applications Stochastic processes MIMO and SISO control systems Etching RIE process Feedback control Adaptive control Plasma properties Programmable control Plasma simulation stochastic adaptive minimum variance control (SMVAC) Stochastic systems MIMO System identification system identification
Content Type	Text
Resource Type	Article

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