NDLI: A new graduate program in electronic packaging and reliability (EPAR)

Content Provider	IEEE Xplore Digital Library
Author	Joshi, Y. Barker, D.B.
Copyright Year	1995
Description	Author affiliation: Dept. of Mech. Eng., Maryland Univ., College Park, MD, USA (Joshi, Y.; Barker, D.B.)
Abstract	A new specialization at the graduate level in Electronic Packaging and Reliability (EPAR) at the University of Maryland is described. This program was initiated to meet the growing industrial need for interdisciplinary expertise in the area of electronic packaging. Initially introduced on a trial basis, it was overwhelmingly approved as a regular program by the Mechanical Engineering faculty in 1993. Currently, a framework of appropriate coursework, examinations and research projects leading to MS and PhD degrees is in place. In order to meet the coursework requirements for these degrees, new introductory and specialized courses have been developed at three levels. The first level core courses serve as the entry points into the graduate program. More focused courses are offered at the second and third levels. Students in the EPAR program are generally required to take half of the academic credits from these courses and the other half as traditional engineering core courses. There is considerable flexibility in accommodating diverse undergraduate backgrounds. Also, with appropriate choice of core and specialized courses, graduate programs with various specializations are easily designed. These areas of specialization within EPAR include mechanics, vibrations, reliability, thermal engineering and computer aided design. In order to effectively respond to the evolving nature of the field, the EPAR courses are kept current by strong industrial participation. Many of the specialized graduate courses include guest lectures by industrial experts.
Starting Page	219
Ending Page	223
File Size	445400
Page Count	5
File Format	PDF
ISBN	0780325966
ISSN	07496877
DOI	10.1109/UGIM.1995.514149
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1995-05-16
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electronics packaging Consumer electronics Electronics industry Reliability engineering Mechanical engineering Government Clothing industry Laboratories Educational institutions Vibrations
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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