NDLI: Multi-band RF SAW filter for mobile phone using surface mount plastic package

Content Provider	IEEE Xplore Digital Library
Author	Yoshimoto, S. Yamamoto, Y. Takahashi, Y. Otsuka, E.
Copyright Year	2002
Description	Author affiliation: Res. & Dev. Dept., NRS Technol. Inc, Kawasaki, Japan (Yoshimoto, S.; Yamamoto, Y.; Takahashi, Y.; Otsuka, E.)
Abstract	In recent years, multi-band RF SAW filters for mobile phone are strongly required. In this work, as the example of multi-band SAW filters, we report PDC triple-band SAW filter and EGSM /DCS dual-band balanced SAW filter using surface mount plastic package. These filters are encapsulated in plastic package and they are made by our new plastic molding technology. The plastic package has advantages of lightweight low material cost and low assembly cost. To integrate plural filters to one chip, we refined the conventional lift-off method. The method can realize easy fabrication of SAW chip for multi-band filter We utilized 36Y-X LiTaO/sub 3/ for substrates for the filter. The electrode structure of each filter is longitudinal-mode resonator filter With regards to PDC triple-band filter, we achieved typical insertion loss of 2.0 dB / 2.1 dB / 2.2 dB with bandwidth of 33 MHz / 15 MHz / 24 MHz for 800 MHz (called CD-band) / 800 MHz (called A-band) / 1.5 GHz, respectively, with excellent high rejection levels. And for another application of the plastic package, we developed EGSM/DCS Rx dual-band balanced SAW filter. We achieved insertion loss of 2.2 dB / 3.0 dB for EGSM and DCS filter, respectively, with good amplitude and phase balance. We could realize multi-band SAW filters using the plastic package and could confirm its usability for SAW devices.
Sponsorship	Ultransonics Ferroelectr., & Frequency Control Soc
Starting Page	113
Ending Page	118
File Size	2681100
Page Count	6
File Format	PDF
ISBN	0780375823
ISSN	10510117
DOI	10.1109/ULTSYM.2002.1193365
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-10-08
Publisher Place	Germany
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Radio frequency SAW filters Mobile handsets Plastic packaging Resonator filters Distributed control Dual band Costs Insertion loss Assembly
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Small-sized dual-band SAW filters using flip-chip bonding technology

Integration of SAW RF Rx filter stacked on a transceiver chip in a QFN package

RF filter design using LTCC and thin film BAW technology

System-in-a-package integration of SAW RF Rx filter stacked on a transceiver chip

Dual-Behavior Resonator (DBR) C-band planar band-pass filter for a space application

Filter technologies for converged RF-frontend architectures: SAW, BAW and beyond

A tunable SAW duplexer

SAW band reject filter performance at 850 MHz

A study of dual-mode bandpass filter integrated in BGA package for single-chip RF transceivers

Multi-band RF SAW filter for mobile phone using surface mount plastic package

Similar Documents

Small-sized dual-band SAW filters using flip-chip bonding technology

Integration of SAW RF Rx filter stacked on a transceiver chip in a QFN package

RF filter design using LTCC and thin film BAW technology

System-in-a-package integration of SAW RF Rx filter stacked on a transceiver chip

Dual-Behavior Resonator (DBR) C-band planar band-pass filter for a space application

Filter technologies for converged RF-frontend architectures: SAW, BAW and beyond

A tunable SAW duplexer

SAW band reject filter performance at 850 MHz

A study of dual-mode bandpass filter integrated in BGA package for single-chip RF transceivers

Multi-band RF SAW filter for mobile phone using surface mount plastic package