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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Wan-Thai Hsu Nguyen, C.T.-C. |
| Copyright Year | 1998 |
| Description | Author affiliation: Center for Integrated Micro Syst., Michigan Univ., Ann Arbor, MI, USA (Wan-Thai Hsu) |
| Abstract | A design technique based upon competition between the thermal dependencies of geometrically tailored stresses and Young's modulus has been demonstrated that (1) reduces the temperature coefficient (TC/sub f/) of the resonance frequencies of folded-beam micromechanical resonators by almost an order of magnitude without any additional power consumption; and (2) introduces a zero TC/sub f/ temperature at which subsequent oven controlled resonators may be biased. In particular, using this design technique, the overall frequency variation of a nickel-plated micromechanical resonator over a 27/spl deg/C to 117/spl deg/C range has been reduced from 2519 ppm to 342 ppm, and zero TC/sub f/ points have been introduced at temperatures ranging from 27/spl deg/C to 57/spl deg/C, specifiable by design. In the preparation of micromechanical devices, localized rapid thermal annealing was found to greatly increase the Q (>13000) and drift stability of the nickel resonators used in this work. |
| Starting Page | 945 |
| Ending Page | 948 |
| File Size | 308882 |
| Page Count | 4 |
| File Format | |
| ISBN | 0780340957 |
| ISSN | 10510117 |
| DOI | 10.1109/ULTSYM.1998.762298 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1998-10-05 |
| Publisher Place | Japan |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Thermal stresses Thermal stability Micromechanical devices Temperature dependence Resonance Resonant frequency Energy consumption Ovens Stress control Temperature control |
| Content Type | Text |
| Resource Type | Article |
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