NDLI: A review of thermal enhancement techniques for electronic systems

Content Provider	IEEE Xplore Digital Library
Author	Fletcher, L.S.
Copyright Year	1990
Description	Author affiliation: Dept. of Mech. Eng., Texas A&M Univ., College Station, TX, USA (Fletcher, L.S.)
Abstract	The demand for electronic components which will satisfy performance standards over a wide range of environmental conditions requires the use of thermal enhancement techniques. Recent thermal enhancement techniques for maximizing the thermal contact conductance, including greases, metallic foils and screens, composite materials and cements, and surface treatments are reviewed. The relative merits of the various enhancement techniques are summarized, and comparisons are made for selected thermal enhancement materials. For most electronic component uses, the use of greases poses a significant problem because of the potential for vaporization and/or migration to other surfaces in the component. The use of metallic foils and screens can provide thermal enhancement at an interface, depending upon the material properties as well as the contact temperature and applied load on the interface. There are a number of synthetic materials which can be used for thermal enhancement, and new materials are continuously being developed. Surface preparation or selected surface finishes can be used to enhance the heat transfer at an interface. Thin layers of vapor-deposited soft metals have been shown to improve the overall heat transfer at an interface significantly.
Starting Page	136
Ending Page	148
File Size	1185694
Page Count	13
File Format	PDF
DOI	10.1109/ITHERM.1990.113324
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1990-05-23
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electronic components Thermal conductivity Surface treatment Surface finishing Heat transfer Composite materials Building materials Conducting materials Thermal loading Material properties
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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