NDLI: Development of a heat spreader for high power electronic modules using thermal vias

Content Provider	IEEE Xplore Digital Library
Author	Ward, A. Nelson, D.J.
Copyright Year	1998
Description	Author affiliation: Bradley Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA (Ward, A.)
Abstract	The Virginia Power Electronics Center at Virginia Tech has performed research to develop improved heat spreader designs for high power electronic modules. The objectives of this work are to maximize thermal conductivity, minimize thermal shear stresses, and improve mechanical toughness of the materials and interfaces used in the heat spreading structure. As a result of this research, a heat spreader design which uses a copper/molybdenum bi-metallic plate has been developed. The structure uses a low thermal expansion material as a base (molybdenum) with copper or metal matrix composite (MMC) filled vias which provide a low thermal resistance path between heat source and sink. The high elastic modulus of the base material acts to constrain the copper or MMC vias from thermal expansion, providing a significant reduction in thermally induced shear stresses at the heat spreader/power module interface. This paper presents the design layout and initial characterization data of the improved heat spreading structure. The processing techniques and bonding materials developed in the course of this research are described, as well as thermal and mechanical models describing the behaviour of the vias and bonding layers during power module operation.
Starting Page	520
Ending Page	523
File Size	444802
Page Count	4
File Format	PDF
ISBN	0780344758
ISSN	10899870
DOI	10.1109/ITHERM.1998.689614
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-05-27
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Power electronics Thermal stresses Thermal expansion Thermal conductivity Copper Thermal resistance Conducting materials Multichip modules Bonding Composite materials
Content Type	Text
Resource Type	Article

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