NDLI: Steady state thermal characterization and junction temperature estimation of multi-chip module packages using the response surface method

Content Provider	IEEE Xplore Digital Library
Author	Zahn, B.A.
Copyright Year	1998
Description	Author affiliation: Package Characterization Lab., Abpac Inc., Phoenix, AZ, USA (Zahn, B.A.)
Abstract	The steady state thermal performance of semiconductor packages has been traditionally reported through the use of a single junction-to-ambient thermal resistance constant commonly referred to as /spl theta//sub ja/. This is particularly inadequate for multi-chip modules, where several devices reside within the same package structure. This paper discusses how a central composite design of experiments can be applied to provide a more accurate thermal characterization of a multi-chip module package. The end product is a series of linear or polynomial equations which can be utilized by the customer to calculate individual device junction temperatures over a wide variation of convection cooling environments and multiple device power dissipations. A 352 plastic ball grid array package, which encompasses three individual devices, is used as an example. The paper steps through the sensitivity analysis and evaluates the accuracy of the resulting equations. This method of thermal characterization can be easily applied to single chip modules of varying power and cooling regimes, or multiple output devices where several power junctions reside within the same integrated circuit.
Starting Page	76
Ending Page	81
File Size	529744
Page Count	6
File Format	PDF
ISBN	0780344758
ISSN	10899870
DOI	10.1109/ITHERM.1998.689522
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-05-27
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Steady-state Thermal resistance Semiconductor device packaging Equations Cooling Polynomials Temperature sensors Power dissipation Plastics Electronics packaging
Content Type	Text
Resource Type	Article

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