NDLI: Known good die for MCMs: Enabling technologies

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Known good die for MCMs: Enabling technologies

Content Provider	IEEE Xplore Digital Library
Author	Keezer, D.C.
Copyright Year	1993
Description	Author affiliation: Dept. of Electr. Eng., Univ. of South Florida, Tampa, FL, USA (Keezer, D.C.)
Abstract	Summary form only given, as follows. The need for known good die for MCMs has been widely recognized. However, satisfying this need has presented many test challenges. Fortunately, the efforts of many workers are now providing the basic technology to assure the performance and reliability of die to be used in MCMs. Performance testing of ICs and chips on wafers is illustrated at gigahertz rates with improvements possible using membrane probes. The recent development of rapid thermal stressing for quick burn-in of ICs presents the possibility of avoiding chip carriers. The point of this paper is to emphasize the availability of effective test methods for known good die and to provide the reader with a solid reference base from which to choose the most appropriate method.
File Size	108451
File Format	PDF
ISBN	0780314301
DOI	10.1109/TEST.1993.470693
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1993-10-17
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Probes Electronic equipment testing Microelectronics Biomembranes Assembly Meetings Thermal stresses Solids Transistors Multichip modules
Content Type	Text
Resource Type	Article

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