NDLI: Multichip module testing methodologies: what's in; what's not

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Multichip module testing methodologies: what's in; what's not

Content Provider	IEEE Xplore Digital Library
Author	Posse, K.
Copyright Year	1994
Description	Author affiliation: Hewlett-Packard Co., USA (Posse, K.)
Abstract	The multichip module (MCM) is rapidly finding its way into the design of commercial electronic systems. The MCM offers this market opportunities for increasing performance, lowering size and weight, lowering power requirements, lowering costs, and improving the functionality per unit area. These characteristics are much too attractive to pass up and thus has begun a headlong rush to create designs using this wonderful new invention. Therefore, the most important element in the cost-effective manufacturing of multichip modules is the accurate diagnosis of defects. This must include the location and cause of manufacturing defects (shorts, opens, wrong component, etc.), functional defects, and performance or timing defects. Surprisingly, such test methods exist and are being used today. The only difficulty with these techniques is that the module designers must be willing to sacrifice some freedom in their designs to meet the testability requirements of the diagnostic methods chosen. Admittedly, this can be a difficult hurdle to overcome; but overcome it we must in order to produce truly high-quality, low-cost modules.
File Size	94005
File Format	PDF
ISBN	0780321030
ISSN	10893539
DOI	10.1109/TEST.1994.527976
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1995-10-02
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Multichip modules Testing Manufacturing Market opportunities Cost function Face recognition Power generation economics Fabrication Application specific integrated circuits Timing
Content Type	Text
Resource Type	Article
Subject	Applied Mathematics Electrical and Electronic Engineering

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