NDLI: A Novel Design of Piezo-Resistive Type Underwater Acoustic Sensor Using SOI Wafer

Content Provider	IEEE Xplore Digital Library
Author	Sie-Yu Li Chih-Chao Hsu Shi-Zheng Lin Ru-Min Chao
Copyright Year	2006
Description	Author affiliation: Nat. Cheng Kung Univ., Tainan (Sie-Yu Li; Chih-Chao Hsu; Shi-Zheng Lin; Ru-Min Chao)
Abstract	This paper reports a novel design of a MEMS type underwater acoustic sensor using SOI (Silicon in Insulator) wafer as the starting material. The structure layer of the SOI wafer provides a uniform membrane thickness which is perfect for sensing structure. By chemical vapor deposition thin layers of silicon nitride and poly-silicon, the sensing membrane and piezo-resistive material are patterned and etched using lithography and dry etching processes, respectively. After the gold wire is patterned, the entire back side of the sensing membrane is etched in order to create the cavity. The waterproof of the hydrophone is completed by deposition a thin layer of Parylene polymer material. Another fabrication technique starting from a 6" single-crystalline silicon wafer by controlled etching method will also present. The sensitivity comparison between the MEMS type acoustic hydrophone and the piezoelectric one is made, and some conclusions are drawn. We have proven that the controlled etching process can create the sensing membrane without difficulties. Currently, the research project is still undergoing, part of the results will be shown at the conference.
Starting Page	1
Ending Page	4
File Size	2190205
Page Count	4
File Format	PDF
ISBN	9781424401376
DOI	10.1109/OCEANSAP.2006.4393840
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-05-16
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Underwater acoustics Acoustic sensors Biomembranes Silicon on insulator technology Chemical sensors Micromechanical devices Dry etching Sonar equipment Insulation Acoustic materials
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in