NDLI: APS, ERP and MES systems integration for semiconductor backend assembly

Content Provider	IEEE Xplore Digital Library
Author	William Liu Chua, T.J. Larn, J. Wang, F.Y. cai, T.X. Yin, X.F.
Copyright Year	2002
Description	Author affiliation: Singapore Inst. of Manuf. Technol., Singapore (William Liu; Chua, T.J.; Larn, J.; Wang, F.Y.; cai, T.X.; Yin, X.F.)
Abstract	In this paper, the system integration of an Advanced Planning and Scheduling (APS) system with Enterprise Resource Planning (ERP) and Manufacturing Execution System (MES) for a Semiconductor Backend Assembly environment is described. The company is one of the worldwide market leaders in semiconductor packaging technology. SIMTech was responsible for the implementation of the Planning & Scheduling functions through its APS application which is called Gintic Scheduling System (GSS). GSS system has been integrated with the other two key manufacturing software systems, namely ERP and MES, with the CIM framework. This paper emphasizes the system integration between the GSS and the customer's existing ERP and MES systems. The paper starts with a broader overview of the APS, ERP and MES systems with the focus on the linkage of APS with ERP and APS with MES. It then introduces the brief background information of the implementation and the integration methodology. Detailed work of the integration is laid out in the fond of integration model structure and illustrated by the system integration mechanism. Various data types that need to be integrated are also elaborated. Further discussions continue with the practical implementation issue like the required frequency of data integration and also the two approaches of data transfer. Finally the paper shares the experiences and lessons the team has learned through the implementation process and concludes the essence of the system integration work.
Starting Page	1403
Ending Page	1408
File Size	468027
Page Count	6
File Format	PDF
ISBN	9810483643
DOI	10.1109/ICARCV.2002.1234978
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-12-02
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Nanyang Technological Univ
Subject Keyword	Enterprise resource planning Assembly systems Job shop scheduling Semiconductor device manufacture Pulp manufacturing Companies Lead compounds Semiconductor device packaging Application software Software systems
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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