NDLI: Thermo-mechanical stress induced by CPI on 3D interposer package

Content Provider	IEEE Xplore Digital Library
Author	Lofrano, M. Gonzalez, M.
Copyright Year	2014
Description	Author affiliation: imec, Leuven, Belgium (Lofrano, M.; Gonzalez, M.)
Abstract	In this work Finite Element Modeling (FEM) is used to investigate the stress and deformation induced by chip package interaction on a 3D interposer package. A Design Of Experiments (DOE) was set up and parameters as epoxy mold compound (EMC) material properties, EMC thickness and die thickness were considered to study their effect on stress and package deformation. The results indicate that using a polymer that combines optimized mechanical properties with specific geometric dimensions makes it possible to reduce the package warpage and consequently the stress in the die. For this study, a multi-level sub modeling technique is used to access the stress distribution in the very small features in the packages, such as Cu μbumps. The stress analysis showed that by increasing the die thickness, the stress induced around μbumps increases. The results also showed that the EMC thickness has less impact on stress around μbumps than the die thickness.
Sponsorship	Philips
Starting Page	1
Ending Page	5
File Size	1738869
Page Count	5
File Format	PDF
e-ISBN	9781479947904
DOI	10.1109/EuroSimE.2014.6813821
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-04-07
Publisher Place	Belgium
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electromagnetic compatibility Stress Three-dimensional displays Laminates Thermomechanical processes Abstracts Polymers
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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