NDLI: Modeling the effects of the PCB motion on the response of microstructures under mechanical shock

Content Provider	IEEE Xplore Digital Library
Author	Ramini, A.H. Younis, M.I. Miles, R.
Copyright Year	2010
Description	Author affiliation: Department of Mechanical Engineering, State University of New York at Binghamton, 13902, USA (Ramini, A.H.; Younis, M.I.; Miles, R.)
Abstract	Microelectomechanical systems (MEMS) are often used in portable electronic products that can be subjected to mechanical shock or impact due to being dropped accidentally. This work presents a modeling and simulation effort to investigate the effect of the vibration of a printed circuit board (PCB) on the dynamics of MEMS microstructures when subjected to shock. Two models are presented. In the first approach, the PCB is modeled as an Euler-Bernoulli beam to which a lumped model of a MEMS device is attached. In the second approach, a special case of a cantilever microbeam is modeled as a distributed-parameter system, which is attached to the PCB. These lumped-distributed and distributed-distributed models are solved numerically by integration of the equation of motion over time using the Galerkin procedure. Results of the two models are compared against each other for the case of a cantilever microbeam and also compared to the predictions of a finite-element model using ANSYS. The influence of the higher order vibration modes of the PCB, the location of the MEMS device on the PCB, the electrostatic forces, damping, and shock pulse duration are presented. It is found that neglecting the effects of the higher order modes of the PCB and the location of the MEMS device can cause incorrect predictions of the response of the microstructure and may lead to failure of the MEMS device. It is observed from the results that in some cases, depending on the different parameters of the problem, the response of the microstructure can be amplified causing early dynamic pull-in and hence possibly failure of the device.
Starting Page	1
Ending Page	9
File Size	11465070
Page Count	9
File Format	PDF
ISBN	9781424470266
e-ISBN	9781424470273
DOI	10.1109/ESIME.2010.5464602
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-04-26
Publisher Place	France
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Microstructure Electric shock Microelectromechanical devices Micromechanical devices Vibrations Predictive models Circuit simulation Printed circuits Numerical models Finite element methods Pull-in Printed Circuit Board Mechanical Shock Electrostatic Force
Content Type	Text
Resource Type	Article

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