NDLI: High-speed mechanical impact reliability of solder interconnections in high-power LEDs

Content Provider	IEEE Xplore Digital Library
Author	Hokka, J. Caers, J.F.J.M. Zhao, X.J. De Jong, M. Peels, W. Sykes, B. Zhang, G.Q. Paulasto-Krockel, M.
Copyright Year	2010
Description	Author affiliation: Aalto University School of Science and Technology, Finland (Hokka, J.; Paulasto-Krockel, M.) \|\| XYZTEC bv, Panningen, The Netherlands (Sykes, B.) \|\| Philips Lighting, Eindhoven, The Netherlands (De Jong, M.; Peels, W.; Zhang, G.Q.) \|\| Philips Applied Technologies, Eindhoven, The Netherlands (Caers, J.F.J.M.; Zhao, X.J.)
Abstract	Light Emitting Diodes (LED) are being implemented more and more into demanding applications like automotive and high-brightness general lighting. From the reliability point of view, the automotive environment is extremely harsh and challenging. Automotive electronics have to withstand exposure to high temperature fluctuations, mechanical shock impacts and vibration. The cyclic thermal load of solder interconnections can be up to 150°C for several thousand cycles. For harsh environments, high-Pb and eutectic AuSn solders are currently being used as the interconnection material. Recent developments of SAC-based solders provide alternative lead-free solutions with lower processing temperature. However, little is known about the reliability and failure mechanism of these solder interconnections, especially under mechanical impact loadings. For a successful reliability test of the solder interconnection under the impact, it is important to find a widely accepted mechanical test method of measuring the degradation of the interconnection. In this study a newly designed high-speed impact tester that is based on the use of a pendulum was used to achieve this target. The purpose was to investigate the mechanical behaviour of lead-free solder interconnections under different loading conditions. The studied carrier had multi dies mounted onto a ceramic sub-mount, which was soldered to a Cu substrate. In total 60 samples were tested with five different test velocities (0.7, 1.0, 1.4, 1.8 and 2.2 m/s). The test results showed that the primary failure mode was the ductile failure in the solder bulk and only some local fractures at the solder interfaces were observed. This indicates that there was no dependency of the test velocity, since all the test velocities induced similar failures in the bulk solder of the solder joints.
Starting Page	1
Ending Page	5
File Size	10250778
Page Count	5
File Format	PDF
ISBN	9781424470266
e-ISBN	9781424470273
DOI	10.1109/ESIME.2010.5464562
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-04-26
Publisher Place	France
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Light emitting diodes Testing Automotive engineering Temperature Environmentally friendly manufacturing techniques Lead LED lamps Automotive electronics Fluctuations Electric shock
Content Type	Text
Resource Type	Article

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