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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Yongjian Feng |
| Copyright Year | 2006 |
| Description | Author affiliation: Dept. of Mech. Electron., Xiamen Univ. (Yongjian Feng) |
| Abstract | In this paper, the novel and low cost method for silicon-silicon bonding is introduced in detail. This direct silicon bonding process on the vacuum and force was developed which any commercial polished silicon wafers can be bonded, include P+ diffusion wafers, without CMP (chemical mechanical polishing) technology at room temperature by using IC technology standard clean. A simple low vacuum micro cleanroom in which uniform force is applied on the bonding wafers is designed for room temperature bonding. Bonding process can be monitored by an infrared (IR) camera system. The criteria for bonding quality evaluation are also presented. All of the process developed is good for MEMS practical application purpose. In this paper, it reports the investigation of low temperature silicon wafer fusion bonding for MEMS application. A bonding process utilizing annealing temperature between 400degC~1100degC was characterized. It was given the process of pressure sensor of Si-Si bonding use vacuum and force equipment and analysis the results using vacuum and force equipment in detail. The silicon-silicon bonded interface was analysed by infrared camera (IR) and scan electron microscope (SEM). The quality of silicon-silicon bonded was tested by etch in TMAH and KOH solution |
| Starting Page | 491 |
| Ending Page | 496 |
| File Size | 326613 |
| Page Count | 6 |
| File Format | |
| ISBN | 1424404657 |
| DOI | 10.1109/ICMA.2006.257602 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2006-06-25 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Silicon Bonding forces Wafer bonding Bonding processes Chemical technology Cameras Micromechanical devices Temperature sensors Force sensors Scanning electron microscopy vacuum Silicon bonding uniform force |
| Content Type | Text |
| Resource Type | Article |
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