NDLI: Simulation of Via Interconnects Using Physics-Based Models and Microwave Network Parameters

Content Provider	IEEE Xplore Digital Library
Author	Rimolo-Donadio, R. Stepan, A.J. Bruns, H.-D. Drewniak, J.L. Schuster, C.
Copyright Year	2008
Description	Author affiliation: Inst. fur Theor. Elektrotechnik, Tech. Univ. of Hamburg-Harburg, Hamburg (Rimolo-Donadio, R.; Stepan, A.J.; Bruns, H.-D.)
Abstract	In this paper, the simulation of via interconnects in multilayered printed circuit boards (PCBs) and packages combining physics-based via models and microwave network theory will be discussed. The description of the via in terms of network parameters, partitioning of the system, and combination of partial results will be addressed. Two alternatives to combine the results are compared, namely multiplication of ABCD matrices and the segmentation method based on S-parameters. The goal of this work is to develop a fast and accurate modeling strategy for via arrays in the multi-gigabit range, extensible to an arbitrary number of elements, and suitable for automation and design optimization. The obtained results show good agreement with respect to 3D electromagnetic field simulations and measurements up to 20 GHz. Hence, this approach is a promising technique for efficient system-level simulation of interconnects.
Starting Page	1
Ending Page	4
File Size	2901998
Page Count	4
File Format	PDF
ISBN	9781424423170
DOI	10.1109/SPI.2008.4558352
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-05-12
Publisher Place	France
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Integrated circuit interconnections Circuit simulation Printed circuits Packaging Microwave theory and techniques Transmission line matrix methods Scattering parameters Design automation Design optimization Electromagnetic fields
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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