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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Jeong-Dong Choe Chang-Sub Lee Sung-Ho Kim Sung-Min Kim Shin-Ae Lee Chang-Woo Oh Ju-Won Lee You-Gyun Shin Donggun Park Kinam Kim |
| Copyright Year | 2003 |
| Description | Author affiliation: R&D Center, Samsung Electron. Co., Kyungki-Do, South Korea (Jeong-Dong Choe) |
| Abstract | We have introduced a novel CMOS transistor fabrication technique using damascene gate with local channel implantation. This transistor has a benefit to reduce the resistance of source/drain extension without severe blanket channel implantation that causes large junction capacitance as well. Reliable process technologies were developed for the formation of channel length down to 22 nm. Gate patterns have no bumpy edges. Some new important processes for the fabrication of these small transistors are also introduced. Physical thickness of gate oxide was 0.9 nm with RTO. The 22 nm nMOSFETs are achieved with a drive current of 500 /spl mu/A//spl mu/m for an off current of 100 nA//spl mu/m at 1.0V. We obtained the hot carrier reliability exceeding 10 years for 1.0V operation. |
| Starting Page | 68 |
| Ending Page | 71 |
| File Size | 232630 |
| Page Count | 4 |
| File Format | |
| ISBN | 0780377656 |
| ISSN | 1524766X |
| DOI | 10.1109/VTSA.2003.1252554 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2003-10-06 |
| Publisher Place | Taiwan |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | MOSFET circuits Fabrication Capacitance Silicon compounds MOS devices Rapid thermal processing CMOS technology Space technology Dielectric substrates Computer aided engineering |
| Content Type | Text |
| Resource Type | Article |
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