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Content Provider | IEEE Xplore Digital Library |
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Author | Snyder, E.S. Campbell, D.V. Swanson, S.E. Pierce, D.G. |
Copyright Year | 1993 |
Description | Author affiliation: Sandia Nat. Lab., Albuquerque, NM, USA (Snyder, E.S.; Campbell, D.V.; Swanson, S.E.; Pierce, D.G.) |
Abstract | A series of self-stressing test structures suitable for investigation of reliability failure mechanisms (hot carriers, electromigration, oxide breakdown) under realistic integrated circuit operating conditions, is described. These structures contain DC-controlled, high-frequency on-chip oscillators, which stress test structures. As a result, high-frequency (>200-MHz) stress-testing can be performed using less expensive DC test systems. In particular, hot-carrier stress-testing was performed at frequencies up to 230 MHz, which is the highest stress frequency reported for inverters. For the 1- mu m technology examined, the quasi-static model accurately describes the degradation. The statistical variation in high-frequency, hot-carrier-induced degradation is presented, and variations with temperature are shown to be consistent with DC stress results. Since only DC test systems are needed, these structures provide a simple method to calibrate reliability simulators and characterize high-frequency reliability effects. |
Starting Page | 57 |
Ending Page | 65 |
File Size | 813183 |
Page Count | 9 |
File Format | |
ISBN | 0780307828 |
DOI | 10.1109/RELPHY.1993.283301 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 1993-03-23 |
Publisher Place | USA |
Access Restriction | Subscribed |
Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subject Keyword | Automatic testing Circuit testing Hot carriers Stress System testing Frequency Degradation Integrated circuit testing Integrated circuit reliability Failure analysis |
Content Type | Text |
Resource Type | Article |
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