NDLI: A Source of Degradation of Plastic Encapsulated Devices

Content Provider	IEEE Xplore Digital Library
Author	Kalmar, G. Nenyei, ZS.
Copyright Year	1983
Description	Author affiliation: INDUSTRIAL RESEARCH INSTITUTE FOR ELECTRONICS, ENTERPRISE MICROELECTRONICS, P. O. BOX. 21. H-1325 BUDAPEST, HUNGARY (Kalmar, G.; Nenyei, ZS.)
Abstract	Some chemical degradation effects in plastic encapsulated semiconductor devices are analysed by the use of pressurecooker tests. After summarising the possible sources of chlorine contamination and its degradation effects, our new results are presented indicating that chlorine contamination of semiconductor devices can also be caused by some washing and cleaning operations. Considering the sensitivity of semiconductor devices in plastic package against different chlorinated hydrocarbons, a group of safe cleaning agents is defined and recomended to device users and manufacturers. A CONSIDERABLE ATTENTION HAS BEEN PAID recently to the effects and origins of chlorine contamination of semiconductor devices. Failure analysis with dedicated instruments /EDS, SEM/ have shown the presence of chlorine in several degraded devices. It has been found, that the interconnecting metallization of semiconductor devices /Au-Al and Al-Al systems/ corrodes incomparably faster if chlorine impurities are present in addition to moisture traces. As possible sources of the chloride contamination mostly impurities, originating from the chip technológy and assembly or the encapsulat ing plastic material itself /-and in special cases , at devices built in circuits, the salt envia ronment-/ has been made responsible. 1,2 In this paper we intend to call attention to some physicochemical and chemical conditions which shall be observed in order to avoid chloride contamination during the cleaning, degreasing and plating operations of the plastic encapsulated devices, and also at post solder cleaning of assembled printed circuit boards.
Starting Page	229
Ending Page	234
File Size	5621964
Page Count	6
File Format	PDF
ISSN	07350791
DOI	10.1109/IRPS.1983.361988
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1983-04-05
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Degradation Semiconductor devices Contamination Cleaning Chemical analysis Semiconductor impurities Assembly Semiconductor device testing Plastic packaging Semiconductor device packaging
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Ion chromatography analysis of fluorine contamination in wafer packaging materials

Silicon Surface Leakage

The Design and Evaluation of Reliable Plastic-Encapsulated Semiconductor Devices

Effect of mold compound components on moisture-induced degradation of gold-aluminium bonds in epoxy encapsulated devices

Finite element analysis application to semiconductor devices

"Moisture Resistance of Plastic Packages for Semiconductor Devices"

Measurement of Alpha Particle Radioactivtiy in IC Device Packages

Hybrid assembly technology for flip-chip-on-chip (FCOC) using PBGA laminate assembly

Package Size Reduction & Solder Joint Reliability for High Density Semiconductor Packaging

A Source of Degradation of Plastic Encapsulated Devices

Similar Documents

Ion chromatography analysis of fluorine contamination in wafer packaging materials

Silicon Surface Leakage

The Design and Evaluation of Reliable Plastic-Encapsulated Semiconductor Devices

Effect of mold compound components on moisture-induced degradation of gold-aluminium bonds in epoxy encapsulated devices

Finite element analysis application to semiconductor devices

"Moisture Resistance of Plastic Packages for Semiconductor Devices"

Measurement of Alpha Particle Radioactivtiy in IC Device Packages

Hybrid assembly technology for flip-chip-on-chip (FCOC) using PBGA laminate assembly

Package Size Reduction & Solder Joint Reliability for High Density Semiconductor Packaging

A Source of Degradation of Plastic Encapsulated Devices