NDLI: An Appraisal of High Temperature Humidity Stress Tests for Assessing Plastic Encapsulated Semiconductor Components

Content Provider	IEEE Xplore Digital Library
Author	Merrett, R. P. Bryant, J. P. Studd, R.
Copyright Year	1983
Description	Author affiliation: British Telecom Research Laboratories, Martlesham Heath, Ipswich IP5 7RE United Kingdom (Merrett, R P; Bryant, J P; Studd, R)
Abstract	Very high temperature, high humidity lifetests and saturated storage ('pressure pot') tests are increasingly being adopted as rapid replacements for the standard 85°C/85% RH lifetests used to assess the susceptibility of plastic encapsulated ICs to moisture. It has also been suggested that a reduction in test time could be achieved by the detection of debonding between the plastic and the die, since debonding may be required to initiate the processes which eventually lead to failure. To evaluate the alternative techniques, CMOS from 6 manufacturers has been subjected to a series of biased lifetests up to 131°C/90% RH and to unbiased saturated storage tests up to 131°C, and a capacitance technique was used to detect the onset of debonding between the plastic and the die. It is concluded that debonding is only a necessary precondition for functional failure during (i) saturated storage tests and (ii) lifetests on specimens having a passivation which is defect free and either contains no phosphorus or has a low phosphorus content, and that in both cases corrosion will be confined to the bond pads. Such corrosion was produced by lifetests on oxide-passivated components, but the majority of failures during these tests were associated with two other corrosion features, namely localised corrosion of passivated tracks and uniform corrosion of all cathodic tracks, neither of which required debonding. There is evidence that the localised corrosion is associated with passivation defects and the uniform corrosion with the presence of phosphorus.
Starting Page	73
Ending Page	82
File Size	13560449
Page Count	10
File Format	PDF
ISSN	07350791
DOI	10.1109/IRPS.1983.361964
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1983-04-05
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Appraisal Temperature Humidity Stress Semiconductor device testing Plastics Corrosion Life testing Passivation Moisture
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Accelerated Humidity Tests for Plastic Encapsulated Devices

The Accelerated Testing of Plastic Encapsulated Semiconductor Components

A New Accelerated Test Method for Moisture Resistance of Plastic Encapsulated Lsis

The Design and Evaluation of Reliable Plastic-Encapsulated Semiconductor Devices

Moisture-Induced Aluminum Corrosion and Stress on the Chip in Plastic-Encapsulated LSIs

Thermal acceleration of compound semiconductors in humidity

Lifetime acceleration model for HAST tests of a pHEMT process

Moisture Resistive, U. V. Transmissive Passivation for Plastic Encapsulated EPROM Devices

The Effects of Phosphorus-Doped Passivation Glass on the Corrosion of Aluminum

An Appraisal of High Temperature Humidity Stress Tests for Assessing Plastic Encapsulated Semiconductor Components

Similar Documents

Accelerated Humidity Tests for Plastic Encapsulated Devices

The Accelerated Testing of Plastic Encapsulated Semiconductor Components

A New Accelerated Test Method for Moisture Resistance of Plastic Encapsulated Lsis

The Design and Evaluation of Reliable Plastic-Encapsulated Semiconductor Devices

Moisture-Induced Aluminum Corrosion and Stress on the Chip in Plastic-Encapsulated LSIs

Thermal acceleration of compound semiconductors in humidity

Lifetime acceleration model for HAST tests of a pHEMT process

Moisture Resistive, U. V. Transmissive Passivation for Plastic Encapsulated EPROM Devices

The Effects of Phosphorus-Doped Passivation Glass on the Corrosion of Aluminum

An Appraisal of High Temperature Humidity Stress Tests for Assessing Plastic Encapsulated Semiconductor Components