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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Chien, W.T.K. Shunwang Chiang Summer Tseng Huang, C.H.J. Yang, K. Wang, W. Zhou, J. |
| Copyright Year | 2003 |
| Description | Author affiliation: Reliability Eng., Semicond. Manuf. Int. Corp., Shanghai, China (Chien, W.T.K.; Shunwang Chiang; Summer Tseng; Huang, C.H.J.; Yang, K.; Wang, W.; Zhou, J.) |
| Abstract | As the product life cycle shrinks, qualification needs to be completed in a much shorter time. This makes wafer level reliability (WLR) an important tool, enabling results to be obtained in a much shorter time. The two key issues for WLR are to guarantee the same failure mechanisms as conventional package-level reliability (PLR) and to maintain a statistically acceptable correlation (in terms of parameter estimation, lifetime projections and trend). We report the correlation of WLR and PLR tests and present WLR control (WLRC) methodology to ensure in-line reliability/process stability and to assist new technology development. We also present WLRC cases/plots/models, which show the benefits of a special control chart and principal component analysis (PCA). Apart from its use for in-line monitoring, by suitably designing the test structures and choosing the fail criteria, we also apply WLRC as a quick assessment of process/tool change qualification. WLRC can be embedded in the wafer acceptance test (WAT). We show how to use WLRC data to formulate reliability-WAT-yield models to facilitate yield improvement and reliability optimization. |
| Sponsorship | IEEE Electron Devices Soc. IEEE Reliability Soc |
| Starting Page | 395 |
| Ending Page | 401 |
| File Size | 413830 |
| Page Count | 7 |
| File Format | |
| ISBN | 0780376498 |
| DOI | 10.1109/RELPHY.2003.1197780 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2003-03-30 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Foundries Testing Qualifications Principal component analysis Failure analysis Wafer scale integration Packaging Maintenance Parameter estimation Stability |
| Content Type | Text |
| Resource Type | Article |
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